360iResearch Logo
Asia-Pacific 3D IC & 2.5D IC Packaging Market
Report Code: MRR-10656D1 | Publishing Date: July 2020 | Number of Pages: 156

The Asia-Pacific 3D IC & 2.5D IC Packaging Market is projected to grow with a significant CAGR in the forecast period. Economic development and substantial infrastructure development have constituted regional revenue generation. Further, the patterns associated with domestic production, import and export, and consumption have helped market participants to analyze and capitalize on potential opportunities. Besides, the qualitative and quantitative parameters provided in the report with detailed analysis highlights the driving and restraining factors of the Asia-Pacific 3D IC & 2.5D IC Packaging Market.

Market Segmentation & Coverage:

The research report categorizes the 3D IC & 2.5D IC Packaging Market to forecast the revenues and analyze the trends in each of the following segments:

Based on Technology, the 3D IC & 2.5D IC Packaging Market studied across 2.5D, 3D TSV, and 3D Wafer-Level Chip-Scale Packaging.

Based on End User, the 3D IC & 2.5D IC Packaging Market studied across Automotive, Consumer Electronics, Industrial Sector, Medical Devices, Military & Aerospace, Smart Technologies, and Telecommunication.

Based on Application, the 3D IC & 2.5D IC Packaging Market studied across Imaging & Optoelectronics, LED, Logic, MEMS/Sensors, Memory, Photonics, Power, Analog and Mixed Signal, RF, and Photonics, and RF.

Based on Geography, the 3D IC & 2.5D IC Packaging Market studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, South Korea, and Thailand.

Cumulative Impact of COVID-19:

COVID-19 is an incomparable global public health emergency that has affected almost every industry, so for and, the long-term effects projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlaying COVID-19 issues and potential paths forward. The report is delivering insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecast, considering the COVID-19 impact on the market.

360iResearch Competitive Strategic Window:

The 360iResearch Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies. The Competitive Strategic Window helps the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. During a forecast period, it defines the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth.

360iResearch FPNV Positioning Matrix:

The 360iResearch FPNV Positioning Matrix evaluates and categorizes the vendors in the 3D IC & 2.5D IC Packaging Market on the basis of Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Company Usability Profiles:

The 3D IC & 2.5D IC Packaging Market is highly competitive and characterized by the presence of a large number of international and regional players in the market. The market has witnessed increased competition between vendors based on the pricing model, technology differentiation, brand name, quality of service, price differentiation, and technical expertise.

The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Asia-Pacific 3D IC & 2.5D IC Packaging Market, including Amkor Technology, ASE Group., Broadcom Ltd, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, and United Microelectronics Corporation.

  1. Preface
    1. Objectives of the Study
    2. Market Segmentation & Coverage
    3. Years Considered for the Study
    4. Currency & Pricing
    5. Language
    6. Stakeholders
  2. Research Methodology
    1. Research Process
      1. Define: Research Objective
      2. Determine: Research Design
      3. Prepare: Research Instrument
      4. Collect: Data Source
      5. Analyze: Data Interpretation
      6. Formulate: Data Verification
      7. Publish: Research Report
      8. Repeat: Report Update
    2. Research Execution
      1. Initiation: Research Process
      2. Planning: Develop Research Plan
      3. Execution: Conduct Research
      4. Verification: Finding & Analysis
      5. Publication: Research Report
    3. Research Outcome
  3. Executive Summary
    1. Market Outlook
    2. Technology Outlook
    3. End User Outlook
    4. Application Outlook
    5. Geography Outlook
    6. Competitor Outlook
  4. Market Overview
    1. Introduction
  5. Market Dynamics
    1. Introduction
    2. Drivers
    3. Restraints
    4. Opportunities
    5. Challenges
  6. Asia-Pacific 3D IC & 2.5D IC Packaging Market, By Technology
    1. Introduction
    2. 2.5D
    3. 3D TSV
    4. 3D Wafer-Level Chip-Scale Packaging
  7. Asia-Pacific 3D IC & 2.5D IC Packaging Market, By End User
    1. Introduction
    2. Automotive
    3. Consumer Electronics
    4. Industrial Sector
    5. Medical Devices
    6. Military & Aerospace
    7. Smart Technologies
    8. Telecommunication
  8. Asia-Pacific 3D IC & 2.5D IC Packaging Market, By Application
    1. Introduction
    2. Imaging & Optoelectronics
    3. LED
    4. Logic
    5. MEMS/Sensors
    6. Memory
    7. Photonics
    8. Power, Analog and Mixed Signal, RF, and Photonics
    9. RF
  9. Asia-Pacific 3D IC & 2.5D IC Packaging Market, By Geography
    1. Introduction
    2. Australia
    3. China
    4. India
    5. Indonesia
    6. Japan
    7. Malaysia
    8. Philippines
    9. South Korea
    10. Thailand
  10. 360iResearch Competitive Strategic Window
    1. Introduction
    2. 360iResearch Competitive Strategic Window, by Technology
    3. 360iResearch Competitive Strategic Window, by End User
    4. 360iResearch Competitive Strategic Window, by Application
    5. 360iResearch Competitive Strategic Window, by Geography
  11. Competitive Landscape
    1. 360iResearch FPNV Positioning Matrix
      1. Quadrants
      2. Business Strategy
      3. Product Satisfaction
    2. 360iResearch Market Ranking Analysis
    3. 360iResearch Market Share Analysis
    4. 360iResearch Competitive Scenario
      1. Merger & Acquisition
      2. Agreement, Collaboration, & Partnership
      3. New Product Launch & Enhancement
      4. Investment & Funding
      5. Award, Recognition, & Expansion
  12. Company Usability Profiles
    1. Amkor Technology
    2. ASE Group.
    3. Broadcom Ltd
    4. TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    5. United Microelectronics Corporation
  13. Appendix
    1. Discussion Guide
    2. Edition Details
    3. License Details
    4. Pricing Details

List of Tables

  1. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2017-2025 (USD MILLION)
  2. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  3. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  4. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  5. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  6. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  7. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  8. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  9. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  10. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  11. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  12. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  13. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  14. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  15. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  16. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  17. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  18. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  19. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  20. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  21. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY POWER, ANALOG AND MIXED SIGNAL, RF, AND PHOTONICS, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  22. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  23. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY GEOGRAPHY, 2017-2025 (USD MILLION)
  24. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  25. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  26. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  27. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  28. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  29. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  30. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  31. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  32. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  33. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  34. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  35. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  36. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  37. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  38. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  39. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  40. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  41. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  42. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  43. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  44. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  45. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  46. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  47. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  48. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2017-2025 (USD MILLION)
  49. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2017-2025 (USD MILLION)
  50. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2017-2025 (USD MILLION)
  51. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: SCORES
  52. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: BUSINESS STRATEGY
  53. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: PRODUCT SATISFACTION
  54. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: RANKING
  55. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: MERGER & ACQUISITION
  56. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: AGREEMENT, COLLABORATION, & PARTNERSHIP
  57. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: NEW PRODUCT LAUNCH & ENHANCEMENT
  58. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: INVESTMENT & FUNDING
  59. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: AWARD, RECOGNITION, & EXPANSION
  60. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: EDITION DETAILS
  61. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: LICENSE DETAILS
  62. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: PRICING DETAILS

List of Figures

  1. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: RESEARCH PROCESS
  2. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: RESEARCH EXECUTION
  3. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2019 VS 2025 (USD MILLION)
  4. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2019 VS 2025 (USD MILLION)
  5. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2019 VS 2025 (USD MILLION)
  6. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2019 VS 2025 (USD MILLION)
  7. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY GEOGRAPHY, 2019 VS 2025 (USD MILLION)
  8. COMPETITIVE SCENARIO ANALYSIS IN ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET, BY TYPE
  9. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2017-2025 (USD MILLION)
  10. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE GROWTH, 2017-2025 (USD MILLION)
  11. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: MARKET DYNAMICS
  12. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2019 VS 2025 (USD MILLION)
  13. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2019 VS 2025 (USD MILLION)
  14. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2019 VS 2025 (USD MILLION)
  15. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY GEOGRAPHY, 2019 VS 2025 (USD MILLION)
  16. COMPETITIVE STRATEGIC WINDOW FOR ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2025
  17. COMPETITIVE STRATEGIC WINDOW FOR ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2025
  18. COMPETITIVE STRATEGIC WINDOW FOR ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2025
  19. COMPETITIVE STRATEGIC WINDOW FOR ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY GEOGRAPHY, 2025
  20. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: 360IRESEARCH FPNV POSITIONING MATRIX
  21. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET: 360IRESEARCH MARKET SHARE ANALYSIS