The Global 3D IC & 2.5D IC Packaging Market to grow from USD 34,952.71 Million in 2019 to USD 146,564.70 Million by 2025, at a Compound Annual Growth Rate (CAGR) of 26.98%.
Market Segmentation & Coverage:
The research report categorizes the 3D IC & 2.5D IC Packaging Market to forecast the revenues and analyze the trends in each of the following segments:
Based on Technology, the 3D IC & 2.5D IC Packaging Market studied across 2.5D, 3D TSV, and 3D Wafer-Level Chip-Scale Packaging.
Based on End User, the 3D IC & 2.5D IC Packaging Market studied across Automotive, Consumer Electronics, Industrial Sector, Medical Devices, Military & Aerospace, Smart Technologies, and Telecommunication.
Based on Application, the 3D IC & 2.5D IC Packaging Market studied across Imaging & Optoelectronics, LED, Logic, MEMS/Sensors, Memory, Photonics, Power, Analog and Mixed Signal, RF, and Photonics, and RF.
Based on Geography, the 3D IC & 2.5D IC Packaging Market studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas region surveyed across Argentina, Brazil, Canada, Mexico, and United States. The Asia-Pacific region surveyed across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, South Korea, and Thailand. The Europe, Middle East & Africa region surveyed across France, Germany, Italy, Netherlands, Qatar, Russia, Saudi Arabia, South Africa, Spain, United Arab Emirates, and United Kingdom.
Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, so for and, the long-term effects projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlaying COVID-19 issues and potential paths forward. The report is delivering insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecast, considering the COVID-19 impact on the market.
360iResearch Competitive Strategic Window:
The 360iResearch Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies. The Competitive Strategic Window helps the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. During a forecast period, it defines the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth.
360iResearch FPNV Positioning Matrix:
The 360iResearch FPNV Positioning Matrix evaluates and categorizes the vendors in the 3D IC & 2.5D IC Packaging Market on the basis of Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.
Company Usability Profiles:
The 3D IC & 2.5D IC Packaging Market is highly competitive and characterized by the presence of a large number of international and regional players in the market. The market has witnessed increased competition between vendors based on the pricing model, technology differentiation, brand name, quality of service, price differentiation, and technical expertise.
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global 3D IC & 2.5D IC Packaging Market, including Amkor Technology, ASE Group., Broadcom Ltd, Intel Corporation., Jiangsu Changjiang Electronics Technology Co. Ltd, Pure Storage, Inc., Samsung Electronics Co. Ltd, STMicroelectronics NV, Taiwan Semiconductor Manufacturing Company Limited, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, and United Microelectronics Corporation.