[180 Pages Report] The 3D IC & 2.5D IC Packaging Market size was estimated at USD 92.36 billion in 2023 and expected to reach USD 118.19 billion in 2024, at a CAGR 28.05% to reach USD 521.49 billion by 2030.
The FPNV Positioning Matrix is pivotal in evaluating the 3D IC & 2.5D IC Packaging Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the 3D IC & 2.5D IC Packaging Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
The report delves into recent significant developments in the 3D IC & 2.5D IC Packaging Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Amkor Technology, Inc., ASE Technology Holding Co, Ltd., Broadcom Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., MonolithIC 3D Inc., Samsung Electronics Co. Ltd, STMicroelectronics NV, Texas Instruments Incorporated, Tezzaron Semiconductor Corporation, Toshiba Electronic Devices & Storage Corporation, United Microelectronics Corporation, and Xilinx Inc..
This research report categorizes the 3D IC & 2.5D IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:
- Technology
- 2.5D
- 3D TSV
- 3D Wafer-Level Chip-Scale Packaging
- End User
- Automotive
- Consumer Electronics
- Industrial Sector
- Medical Devices
- Military & Aerospace
- Smart Technologies
- Telecommunication
- Application
- Imaging & Optoelectronics
- LED
- Logic
- Memory
- MEMS/Sensors
- Photonics
- RF
- Region
- Americas
- Argentina
- Brazil
- Canada
- Mexico
- United States
- California
- Florida
- Illinois
- New York
- Ohio
- Pennsylvania
- Texas
- Asia-Pacific
- Australia
- China
- India
- Indonesia
- Japan
- Malaysia
- Philippines
- Singapore
- South Korea
- Taiwan
- Thailand
- Vietnam
- Europe, Middle East & Africa
- Denmark
- Egypt
- Finland
- France
- Germany
- Israel
- Italy
- Netherlands
- Nigeria
- Norway
- Poland
- Qatar
- Russia
- Saudi Arabia
- South Africa
- Spain
- Sweden
- Switzerland
- Turkey
- United Arab Emirates
- United Kingdom
- Americas
- Market Penetration: It presents comprehensive information on the market provided by key players.
- Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
- Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
- Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
- Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
- What is the market size and forecast of the 3D IC & 2.5D IC Packaging Market?
- Which products, segments, applications, and areas should one consider investing in over the forecast period in the 3D IC & 2.5D IC Packaging Market?
- What are the technology trends and regulatory frameworks in the 3D IC & 2.5D IC Packaging Market?
- What is the market share of the leading vendors in the 3D IC & 2.5D IC Packaging Market?
- Which modes and strategic moves are suitable for entering the 3D IC & 2.5D IC Packaging Market?
- Preface
- Research Methodology
- Executive Summary
- Market Overview
- Market Insights
- 3D IC & 2.5D IC Packaging Market, by Technology
- 3D IC & 2.5D IC Packaging Market, by End User
- 3D IC & 2.5D IC Packaging Market, by Application
- Americas 3D IC & 2.5D IC Packaging Market
- Asia-Pacific 3D IC & 2.5D IC Packaging Market
- Europe, Middle East & Africa 3D IC & 2.5D IC Packaging Market
- Competitive Landscape
- Competitive Portfolio
- List of Figures [Total: 22]
- List of Tables [Total: 302]
- List of Companies Mentioned [Total: 16]
What are 3D IC and 2.5D IC Packaging?
3D IC packaging involves stacking two or more IC dies, creating a high-performance, high-density package. This technique involves using TSV (Through Silicon Via) and wafer bonding technologies that allow for vertically stacking multiple layers. The result is a more streamlined, faster, and power-efficient package.
2.5D IC packaging, on the other hand, involves interconnecting multiple IC dies, each placed on an independent substrate. The packages are then stacked together to form one final package. Unlike 3D IC packaging, 2.5D IC packaging does not involve vertically stacking dies. Instead, the IC dies are arranged side by side on a substrate, and the interposer chip is used to make interconnects between the dies.
How do They Work?
3D IC and 2.5D IC packaging technologies adopt a vertical approach to interconnects, making them faster and more energy-efficient. They make it possible to combine the functionalities of different IC dies into one package. This approach helps reduce the device's overall complexity, lowering power consumption and increasing performance.
The 3D IC packaging technology works by stacking multiple dies on top of each other using TSV. Each die is connected through small holes in the chip that allow for interconnects between the different die layers. Each layer of the chip has its own power and ground planes, which help reduce power consumption and electromagnetic interference.
On the other hand, the 2.5D IC packaging technology involves placing the dies on an interposer, which acts as a bridge between the different IC dies. The interposer is a small chip that sits between the different IC dies and helps make interconnects between them. The interposer also acts as a thermal bridge, reducing heat buildup in the package.
Benefits of 3D IC and 2.5D IC Packaging:
The benefits of using 3D IC and 2.5D IC packaging technologies in electronic product design are numerous. They offer a higher level of integration and performance, reducing the complexity of the overall design. By allowing multiple IC dies to be stacked on top of each other or placed side by side, these packaging technologies can increase power efficiency and extend battery life.
Another significant benefit of 3D IC and 2.5D IC packaging technologies is their ability to reduce the overall footprint of the package. A more streamlined design makes it possible for electronic devices to be smaller and lighter, opening up new possibilities for wearable tech and other mobile devices.
3D IC and 2.5D IC packaging technologies are essential advancements in electronic product design. They offer many benefits that make electronic devices smaller, faster, more power-efficient, and with increased functionality. As the demand for advanced design in electronic products continues to grow, manufacturers need to embrace these technologies to stay ahead of the competition.
- How big is the 3D IC & 2.5D IC Packaging Market?
- What is the 3D IC & 2.5D IC Packaging Market growth?
- When do I get the report?
- In what format does this report get delivered to me?
- How long has 360iResearch been around?
- What if I have a question about your reports?
- Can I share this report with my team?
- Can I use your research in my presentation?