Thick-Film Hybrid Integrated Circuits Market by Product Type (Customized Products, Standard Products), Substrate Material (Alumina (Al2O3), Aluminum Nitride (AlN), Glass Ceramic), Technology, Component Integration, Packaging Type, Mounting Type, End Use Industry, Application, Power Rating, Frequency Range, Production Volume, Reliability And Performance Grade, Fabrication Process, Sales Channel, Regulatory Compliance - Global Forecast 2026-2032